Nick Telford-Reed

Executive Advisor
Endava

A passionate, award-winning technology innovator, communicator, and leader of both
people and strategy in the service of great customer experience. Comfortable on either
side of the product/technology line, I work to develop compelling visions of the future, to
build strategies to move towards those goals, and to build and run engaged, enthused,
self-organised teams to develop and deliver products and services to customers.

Beginning my career in start-ups before joining global payments giant, Worldpay, in 2001, I have led engineering and product teams through divestments and acquisitions, crossed the chasm from challenger organisation to incumbent world leader and consistently built process and capability on-shore, near-shore and off-shore with the aim of delivering agile
technology and product organisations. I have led engineering teams as CTO of the
Worldwide Payment Gateway and latterly led Worldpay’s architecture and innovation
teams.
In 2018, my team won Best Mobile Payment Initiative at the Cards and Payments Awards
and in 2019 I joined Endava as an Executive Advisor in their Payments and Fintech practice.
At the World Wide Web Consortium (W3C) , I am the chair of the Web Payments
Working Group, and am also an invited expert in the European Working Group of the FIDO
Alliance global identity authentication organisation.

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